Overview
Register Now
Join the TSMC OIP Forum and Technology Symposium and get first-hand updates on TSMC's advanced and specialty technologies, advanced backend capabilities and future development plans!
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Monday, 7/23/2018 - TSMC Europe (Amsterdam) OIP Ecosystem Forum | |
| Hilton Amsterdam Airport Schiphol | ||
| Amsterdam, Netherlands | ||
| Registration Opens at 10:30 a.m. | ||
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Tuesday, 7/24/2018 - TSMC Europe (Amsterdam) Technology Symposium | |
| Hilton Amsterdam Airport Schiphol | ||
| Amsterdam, Netherlands | ||
| Registration Opens at 8:30 a.m. | ||
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Wednesday, 9/5/2018 - TSMC Israel (Herzliya) Technology Workshop | |
| Dan Accadia Hotel Herzliya | ||
| Herzliya, Israel | ||
| Registration Opens at 9:30 a.m. | ||
The future of the semiconductor industry is promising with many growth opportunities ahead. To capture these opportunities, we need to continue to work as a collaborative innovation force. Together, we will help each other grow business and stay competitive. This vision is the foundation for the TSMC Grand Alliance. At TSMC, customers are always at the center of all our efforts. With this spirit, TSMC has become our customers' TRUSTED technology and capacity provider.
Join the 2018 TSMC OIP Forum.
Learn how OIP partners are unleashing your innovations with leading edge design and IP.
OIP Partners will share experiences in design solutions and give updates on the latest IP availability.
Learn how TSMC's Open Innovation Platform® Ecosystem reduces customer's design time.
Join the 2018 TSMC Technology Symposium. Learn how TSMC is committed to being your trusted technology and capacity provider.
Get the latest on:
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TSMC’s application-specific platforms unleash customers’ innovation |
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TSMC's advanced technology roadmap includes progress on the 12nm, 7nm, 7nm+, 5nm processes and beyond |
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TSMC's specialty technology breakthroughs |
| • 22ULL ultra-low power processes, | |
| • 22nm and 12nm RF processes, | |
| • 40nm and 28nm embedded memory and next gen NVM | |
| • 0.13u and 55nm BCD power management, | |
| • sensor technologies | |
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TSMC's leading advanced packaging technology includes InFO, CoWoS® and other exciting innovations |
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TSMC's integrated precision manufacturing and capacity expansions |
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TSMC's Open Innovation Platform® Ecosystem reduces customer's design time |
To ensure the quality of your networking opportunities, all attendees will undergo a registration screening process. For more information about the TSMC Technology Symposium, e-mail us at: tsmcevents@tsmc.com.
We look forward to welcoming you at the 2018 TSMC OIP forum and Technology Symposium!
